| OEM |
Original Equipment Manufacturer.
A company/individual that purchases computers or other complex components from manufacturers (Parallax), adds other
hardware or software, and sells the systems, often for specific applications. |
| IC |
Integrated Circuit. More commonly referred to as a chip. |
| SMD |
Surface Mount Device. Usually refers to a surface mount component. |
| SMT |
Surface Mount Technology. Refers to the surface mount genre of electronics assembly |
| TH |
Through Hole. Pertains to conventional electronic components whose terminals pass through the printed circuit board. Note: This resonator will NOT tolerate the heat associated with wave soldering so it must be hand-soldered. |
| SO, SOIC |
Small Outline, SOIC refers to IC package type. Small Outline Integrated Circuit. This is the larger and less common of the two SMD ICs. |
| SS, SSOP |
SSOP refers to IC package type. Super Small Outline Package. This is the
smaller of the two common SMD ICs. |
| DIP |
Dual In-line Package. Typical TH IC with two rows of
legs parallel to one another. |
| PDIP |
Plastic DIP |
| CERDIP |
Ceramic DIP |
| PCB |
Printed Circuit Board |
| SX Chip |
A microcontroller manufactured by Ubicom which may serve as an interpreter chip if ordered as a PBASIC part (ex: PBASIC2C/P). |
| PBASIC |
Parallax Basic All-Purpose Simple Instruction Code. The PBASIC designation will appear in the part number of a genuine Parallax Interpreter Chip. Note: Standard SX chips (ex: SX18AC/DP) do not include the PBASIC interpreter code and therefore function as microcontrollers programmed using Assembly or the SX/B compiler. |
| PBASIC Interpreter Chip |
A Microchip PIC chip or Ubicom SX chip containing special PBASIC coding to make it function as a BASIC Stamp microcontroller. All features of the corresponding BASIC Stamp module including reprogrammability are included. |